Today's PCB sharing is a via filled by resin and capped PCB. Made from RO4003C hydrocarbon ceramic laminates, this PCB is ideal for use in a variety of applications. With a lead-free process and -40℃ to +85℃ temperature range, this PCB is environmentally friendly and can operate in extreme temperatures.
The PCB measures 136mm x 96mm, with a finished board thickness of 0.6mm and finished copper weight of 1.5 oz (2.1 mils) all layers. It features 96 components and 128 total pads, including 54 thru-hole pads, 72 top SMT pads, and 0 bottom SMT pads. With a minimum trace/space
of 4/4 mils and minimum hole size of 0.2mm, this PCB provides high-density interconnectivity.
The PCB is constructed using electroless nickle immersion gold (ENIG) surface finish for improved solderability and corrosion resistance. It also features a green top and bottom solder mask, with no silkscreen on the solder pads. The slotted holes defined as per Gerber are plated through, with side-by-side holes defining the dimensions of the slots.
The PCB meets IPC-Class-2 standards and has been 100% electrically tested to ensure reliability. It also features 0.2mm and 0.5mm via filled by resin and capped as per IPC-4761 Type VII. With worldwide service area, this PCB is perfect for a wide range of applications.
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.55 | Z | | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factortan,δ | 0.0027
0.0021 | Z | | 10 GHz/23℃
2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 4.2 x 109 | | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850)
19,450(2,821) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2)
100(14.5) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276
(40) | | MPa
(kpsi) | | IPC-TM-650 2.4.4 |
| Dimensional Stability | <0.3 | X,Y | mm/m
(mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11
14
46 | X
Y
Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | | ℃ TMA | A | IPC-TM-650 2.4.24.3 |
| Td | 425 | | ℃ TGA | | ASTM D 3850 |
| Thermal Conductivity | 0.71 | | W/M/oK | 80℃ | ASTM C518 |
| Moisture Absorption | 0.06 | | % | 48hrs immersion 0.060"
sample Temperature 50℃ | ASTM D 570 |
| Density | 1.79 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 1.05
(6.0) | | N/mm
(pli) | after solder float 1 oz.
EDC Foil | IPC-TM-650 2.4.8 |
| Flammability | N/A | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
Why sugguest RO4003C?
RO4003C boasts a dielectric constant of 3.38±0.05 and a design dielectric constant of 3.55, making it the ideal material for high-frequency applications. It also has a low dissipation factor of 0.0027 and 0.0021 at 10 GHz/23℃ and 2.5 GHz/23℃, respectively, ensuring excellent signal integrity. Plus, with a thermal coefficient of ε of +40 ppm/℃ from -50℃ to 150℃, RO4003C can withstand even the most extreme temperatures!
But that's not all – RO4003C provides several advantages over other PCB materials. It ensures superior signal integrity due to its low dielectric constant and dissipation factor, making it an ideal choice for high-frequency and high-speed digital applications. Its low thermal coefficient of ε also makes it suitable for use in high-temperature environments, and it is lead-free process compatible, making it an environmentally friendly option.
RO4003C is suitable for a wide range of demanding applications, including RF/microwave applications, high-speed digital applications, and aerospace and defense. It can even operate in temperatures ranging from -40℃ to +85℃, making it ideal for harsh environments and extreme conditions.
Compared to other PCB materials, RO4003C provides superior high-frequency performance and signal integrity. Its low thermal coefficient of ε also ensures better performance in high-temperature environments. And, with its cost-effectiveness, RO4003C is a popular choice for PCB manufacturing.
Don't miss out on the future of PCB event – choose RO4003C for your next project! With its excellent properties and versatility, RO4003C is sure to impress and provide the high-performance results you need. Contact us today to learn more about how RO4003C can take your PCB to the next level!
Product Tags:
|
|
RO4003C Via Filled PCB Low DK For RF Applications Images
|
