Assembled Flexible PCB Built On 0.15mm Polyimide (PI) With Immersion Gold for Portable Sound System
(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)
General description
This is a type of assembled flexible PCB built on polyimide substrate with Tg 60°C for the application of Portable Sound System. It's 2 layer FPC at 0.15 mm thick, white silkscreen on yellow coverlay (solder mask) covering both sides and immersion gold on pads. Polyimide as stiffener is on the back of one end. The base material is from Shengyi, entire board supplying 34 PCBs per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 panels are packed for shipment.
Parameter and data sheet
| PCB Size: | 29 x 4.0mm, 121 x 75.5mm=34 pcs |
| Number of Layers | 2 layers |
| Board Type | Flexbile cirucit |
| Board Thickness | 0.15mm +/-10% |
| Board Material | Polyimide (PI) 25um |
| Board Material Supplier | Shengyi |
| Tg Value of Board Material | 60℃ |
| |
| PTH Cu thickness | 20 um |
| Inner Iayer Cu thicknes | N/A |
| Surface Cu thickness | 35 um (1oz) |
| |
| Coverlay Colour | Yellow |
| Number of Coverlay | 2 |
| Thickness of Coverlay | 25 um |
| Stiffener | Polyimide 0.3mm |
| |
| Type of Silkscreen Ink | Taiyo |
| Supplier of Silkscreen | Taiyo |
| Color of Silkscreen | White |
| Number of Silkscreen | 1 |
| |
| Minimum via (mm) | 0.3 |
| Minimum Trace (mil) | 8.0 |
| Minimum Gap(mil) | 7.3 |
| |
| Surface Finish | Immersion Gold |
| RoHS Required | Yes |
| Famability | 94-V0 |
| |
| Thermal Shock Test | Pass, -25℃±125℃, 1000 cycles. |
| Thermal Stress | Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
| Type of artwork to be supplied | email file, Gerber RS-274-X, PCBDOC etc |
| Service area | Worldwide, Globally. |
Features and benefits
Excellent flexibility;
Reducing the volume;
Weight reduction;
Consistency of assembly;
SMT process is resistant to reflow soldering, resistant to rework;
Comprehensive equipment management and maintenance and process control;
Strict WIP inspection and monitoring as well as working instruction;
Small quantity order is accepted;
12 hours quotation;
Prototype PCB capability;
Volume Production capability;
Applications
Thin-film switch, Capacitive touch screen / panel, mobile phone antenna flex board, mobile phone module flex board, FFC for industrial control equipment, industrial control touch remote control soft board, Tablet PC camera soft board, Tablet computer battery soft board
Clarifications of FPC
According to the combination of base material and copper foil, flexible circuit board can be divided into two types: flexible board with adhesive and flexible board without adhesive. The price of non-adhesive flexible PCB is much higher than that of adhesive flexible PCB, but its flexibility, bonding force between copper foil and substrate and flatness of solder are also better than that of adhesive flexible PCB. So it is only used in the high demand situations, such as the: COF (CHIP ON FLEX, flexible board with bare chip, the high flatness of the pad) and so on. Because its price is high, most of the flexible PCBs used in the market are still adhesive flexible circuit board. Because the flexible circuit board is mainly used in the situation where bending is required, if the design or process is not reasonable, it is easy to produce micro-cracks, welding and other defects.
Economy of using FPC
If the circuit design is relatively simple, the total volume is small, and the space is suitable, the traditional internal connection is much cheaper. Flexible circuits are a good design option if the circuit is complex, processes many signals or has special electrical or mechanical requirements. When the size and performance of applications exceed the capacity of rigid circuits, flexible assembly is the most economical. A 12mil pad with a 5mil through hole and a flexible circuit with 3mil lines and spacing can be fabricated on a thin film. Therefore, it is more reliable to mount the chip directly on the film. There is no flame retardant that could be an ion source. These films may be protective and solidified at higher temperatures to obtain higher glass transition temperatures. Flexible materials are less costly than rigid materials because they are free of connectors.
