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20mil Double Sided 1oz RF PCB Board With RT/Duroid 5870 Base Material

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20mil Double Sided 1oz RF PCB Board With RT/Duroid 5870 Base Material

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Brand Name : Bicheng

Model Number : BIC-016.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Base material : RT/Duroid 5870

PCB size : 99 x 65mm=1PCS

PCB thickness : 0.6mm

Layer count : 2 layers

Copper weight : 1oz

Surface finish : immersion gold

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Rogers RT/Duroid 5870 20mil 0.508mm High Frequency PCB Double Sied RF PCB for Millimeter Wave Applications

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers RT/duroid 5870 high frequency material is glass microfiber reinforced PTFE composites which is designed for exacting stripline and microstrip circuit applications. The exceptional dielectric constant uniformity results from its randomly oriented microfibers. The dielectric constant of RT/duroid 5870 is uniform from panel to panel and is constant over a wide frequency range. Its low dissipation factor extends the usefulness of RT/duroid 5870 to Ku-band and above. RT/duroid 5870 materials are easily cut, sheared and machined to shape. They are resistant to all solvents and reagents, hot or cold, normally used in etching printed circuits or in plating edges and holes.

The typical applications are commercial airline broadband antennas, microstrip circuits, stripline circuits, millimeter wave applications, military radar systems, missile guidance systems and point to point digital radio antennas etc.

PCB Specifications

PCB SIZE 99 x 65mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 35um(1 oz)+plate TOP layer
RT/duroid 5870 0.508mm
copper ------- 35um(1oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space: 5 mil / 4.5 mil
Minimum / Maximum Holes: 0.3 mm / 4.6 mm
Number of Different Holes: 7
Number of Drill Holes: 105
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy: RT/duroid 5870 0.508mm
Final foil external: 1.0 oz
Final foil internal: N/A
Final height of PCB: 0.6 mm ±0.1
PLATING AND COATING
Surface Finish Immersion Gold
Solder Mask Apply To: N/A
Solder Mask Color: N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend n/a
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 0.3mm. Solder mask uncovered
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

Data Sheet of Rogers RT/duroid 5870

RT/duroid 5870 Typical Value
Property RT/duroid 5870 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.33
2.33±0.02 spec.		 Z N/A C24/23/50
C24/23/50		 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign 2.33 Z N/A 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0005
0.0012		 Z N/A C24/23/50
C24/23/50		 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε -115 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 2 x 107 Z Mohm cm C/96/35/90 ASTM D 257
Surface Resistivity 3 x 107 Z Mohm C/96/35/90 ASTM D 257
Specific Heat 0.96(0.23) N/A j/g/k
(cal/g/c)		 N/A Calculated
Tensile Modulus Test at 23℃ Test at 100℃ N/A MPa(kpsi) A ASTM D 638
1300(189) 490(71) X
1280(185) 430(63) Y
Ultimate Stress 50(7.3) 34(4.8) X
42(6.1) 34(4.8) Y
Ultimate Strain 9.8 8.7 X %
9.8 8.6 Y
Compressive Modulus 1210(176) 680(99) X MPa(kpsi) A ASTM D 695
1360(198) 860(125) Y
803(120) 520(76) Z
Ultimate Stress 30(4.4) 23(3.4) X
37(5.3) 25(3.7) Y
54(7.8) 37(5.3) Z
Ultimate Strain 4 4.3 X %
3.3 3.3 Y
8.7 8.5 Z
Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570
Thermal Conductivity 0.22 Z W/m/k 80℃ ASTM C 518
Coefficient of Thermal Expansion 22
28
173		 X
Y
Z		 ppm/℃ 0-100℃ IPC-TM-650 2.4.41
Td 500 N/A ℃ TGA N/A ASTM D 3850
Density 2.2 N/A gm/cm3 N/A ASTM D 792
Copper Peel 27.2(4.8) N/A Pli(N/mm) 1oz(35mm)EDC foil
after solder float		 IPC-TM-650 2.4.8
Flammability V-0 N/A N/A N/A UL 94
Lead-free Process Compatible Yes N/A N/A N/A N/A


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Duroid 5870 RF PCB Board

      

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1oz Double Sided Circuit Board

      
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