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High Tg PCB Printed Circuit Board S1000-2MB Prepreg With Immersion Gold

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High Tg PCB Printed Circuit Board S1000-2MB Prepreg With Immersion Gold

Brand Name : Bicheng

Model Number : BIC-504.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Base material : High Tg, High Performance and Low CTE Epoxy Resin

PCB thickness : 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm

Layer count : Double Layer, Multilayer, Hybrid PCB

PCB size : ≤400mm X 500mm

Solder mask : Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.

Copper weight : 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)

Surface finish : Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..

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High Tg Printed Circuit Board (PCB) on S1000-2M Core and S1000-2MB Prepreg with Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

General Description

S1000-2M is a type of High Tg printed circuit board material manufactured by Shengyi with characteristics of high performance and low CTE, suitable for high multilayer PCB. The thickness ranges 0.05mm to 3.2mm, copper weight 0.5oz to 3oz etc.

Features

Lead-free compatible FR-4 laminate

Tg170℃ (DSC), UV Blocking/AOI compatible

High heat resistance

Lower Z-axis CTE

Excellent through-hole reliability

Excellent Anti-CAF performance

Low water absorption

Excellent mechanical processability

High Tg PCB Printed Circuit Board S1000-2MB Prepreg With Immersion Gold

Applications

Computer

Communication

Automotive electronics

Suitable for high layer count PCB

Our PCB Capability (S1000-2M)

PCB Material: High Tg, High Performance and Low CTE Epoxy Resin
Designation: S1000-2M
Dielectric constant: 4.6 at 10GHz
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

General Properties of S1000-2M

Test Items Test Method Test Condition Unit Typical Value
Tg IPC-TM-650 2.4.24.4 DMA ℃ 185
IPC-TM-650 2.4.25D DSC ℃ 180
Td IPC-TM-650 2.4.24.6 TGA (5% W.L) ℃ 355
T260 IPC-TM-650 2.4.24.1 TMA min >60
T288 IPC-TM-650 2.4.24.1 TMA min 30
T300 IPC-TM-650 2.4.24.1 TMA min 15
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip s >100
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 41
IPC-TM-650 2.4.24 After Tg ppm/℃ 208
IPC-TM-650 2.4.24 50-260℃ % 2.4
Permittivity (1GHz) IPC-TM-650 2.5.5.9 C-24/23/50 - 4.6
Loss Tangent (1GHz) IPC-TM-650 2.5.5.9 C-24/23/50 - 0.018
Volume Resistivity IPC-TM-650 2.5.17.1 C-96/35/90 MΩ-cm 8.7×108
Surface Resistivity IPC-TM-650 2.5.17.1 C-96/35/90 MΩ 2.2×107
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-0.5/23 s 133
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-0.5/23 kV >45
Peel Strength (1oz) IPC-TM-650 2.4.8 288℃/10s N/mm [lb/in] 1.3 [7.43]
Flexural Strength (LW/CW) IPC-TM-650 2.4.4 A Mpa 567/442
Water Absorption IPC-TM-650 2.6.2.1 D-24/23 % 0.08
Flammability UL94 C-48/23/50 Rating V-0
CTI IEC60112 A Rating PLC 3


Product Tags:

High Tg PCB Printed Circuit Board

      

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0.6mm PCB Printed Circuit Board

      
Quality High Tg PCB Printed Circuit Board S1000-2MB Prepreg With Immersion Gold for sale

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