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Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB

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Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB

Brand Name : Bicheng

Model Number : BIC-508.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Base material : High Temperature Resin

Layer count : Double Layer, Multilayer, Hybrid PCB

PCB thickness : 0.5mm,0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm

PCB size : ≤400mm X 500mm

Solder mask : Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.

Copper weight : 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)

Surface finish : Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..

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Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

General Description

ThunderClad 2 ( TU-883 ) is a very low loss category material based on a high performance resin. This material is reinforced with regular woven E-glass and designed with very low dielectric constant and dissipation factor resin system for high speed low loss, radio frequency and wireless applications. ThunderClad 2 material is suitable for environmental protection lead free process and also compatible with FR-4 processes. ThunderClad 2 laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability and CAF resistance.

Applications

Radio frequency

Backplane, High performance computing

Line cards, Storage

Servers, Telecom, Base station, Office Routers

Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB

Performance and Processing Advantages

Excellent electrical properties

Dielectric constant less than 4.0

Dissipation factor less than 0.005

Stable and flat Dk/Df performance over frequency and temperature

Compatible with modified FR-4 processes

Excellent moisture resistance and Lead Free reflow process compatible

Improved z-axis thermal expansion

Anti-CAF capability

Excellent through-hole and soldering reliability

Halogen Free

Our PCB Capabilities (TU-883)

PCB Material: High Temperature Resin
Designation: TU-883
Dielectric constant: 3.60 at 1GHz
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness: 0.5mm,0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

Typical Properties of TU-883

Typical Values Test Condition SPEC
Thermal
Tg (DMA) 220 °C
Tg (TMA) 170 °C E-2/105+des N/A
Td (TGA) 420 °C
CTE z-axis α1 35 ppm/°C Pre-Tg < 60 ppm/°C
CTE z-axis α2 240 ppm/°C Post-Tg < 300 ppm/°C
CTE z-axis 2.50% 50 to 260°C < 3.0%
Thermal Stress, Solder Float, 288°C > 60 sec A > 10 sec
T-260 > 60 min > 30 min
T-288 > 60 min E-2/105+des > 15 min
T-300 > 60 min
Flammability 94V-0 E-24/125+des 94V-0
Electrical
Permittivity (RC63%)
1GHz (SPC method) 3.60
5GHz (SPC method) 3.58 C-24/23/50 N/A
10GHz (SPC method) 3.57
Loss Tangent (RC63%)
1GHz (SPC method) 0.0030
5GHz (SPC method) 0.0037 C-24/23/50 N/A
10GHz (SPC method) 0.0046
Volume Resistivity > 1010 MΩ•cm C-96/35/90 > 106 MΩ•cm
Surface Resistivity > 108 MΩ C-96/35/90 > 104 MΩ
Electric Strength > 40 KV/mm - > 30 KV/mm
Dielectric Breakdown Voltage > 50 KV - > 40 KV
Mechanical
Young’s Modulus
Warp Direction 28 GPa A N/A
Fill Direction 26 GPa
Flexural Strength
Lengthwise > 60,000 psi A > 60,000 psi
Crosswise > 50,000 psi A > 50,000 psi
Peel Strength, 1.0 oz. Cu foil 4~6 lb/in A > 4 lb/in
Water Absorption 0.08% E-1/105+des+D-24/23 < 0.8 %

Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB


Product Tags:

Resin Backplane Pcb Circuit Board

      

0.6mm Thickness Pcb Circuit Board

      

IATF16949 Pcb Circuit Board

      
Quality Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB for sale

Low Loss Printed Circuit Board (PCB) on TU-883 Substrate and TU-883P Prepreg Multi-layer TU-883 PCB Images

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