The Rogers RO3006 is a ceramic-filled PTFE composite laminate designed to offer exceptional electrical and mechanical stability for a variety of high-frequency applications. This advanced circuit material provides a stable dielectric constant (Dk) over a wide range of temperatures, eliminating the Dk step change that can occur in PTFE glass materials near room temperature.
Key Features:
Dielectric constant of 6.15 ± 0.15 at 10 GHz and 23°C
Dissipation factor of 0.002 at 10 GHz and 23°C
Thermal decomposition temperature (Td) greater than 500°C
Thermal conductivity of 0.79 W/mK
Moisture absorption of 0.02%
Coefficient of thermal expansion (CTE):
X-axis: 17 ppm/°C
Y-axis: 17 ppm/°C
Z-axis: 24 ppm/°C
| RO3006 Typical Value |
| Property | RO3006 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 6.15±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 6.5 | Z | | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor,tanδ | 0.002 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | -262 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.27
0.15 | X
Y | mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 105 | | MΩ.cm | COND A | IPC 2.5.17.1 |
| Surface Resistivity | 105 | | MΩ | COND A | IPC 2.5.17.1 |
| Tensile Modulus | 1498
1293 | X
Y | MPa | 23℃ | ASTM D 638 |
| Moisture Absorption | 0.02 | | % | D48/50 | IPC-TM-650 2.6.2.1 |
| Specific Heat | 0.86 | | j/g/k | | Calculated |
| Thermal Conductivity | 0.79 | | W/M/K | 50℃ | ASTM D 5470 |
Coefficient of Thermal Expansion
(-55 to 288℃) | 17
17
24 | X
Y
Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | | ℃ TGA | | ASTM D 3850 |
| Density | 2.6 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 7.1 | | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 |
| Flammability | V-0 | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
Benefits:
Uniform mechanical properties across a range of dielectric constants, ideal for multi-layer board designs
Suitable for use with epoxy glass multilayer board hybrid designs
Low in-plane expansion coefficient, matching copper for more reliable surface-mounted assemblies
Excellent dimensional stability, making it suitable for applications sensitive to temperature changes
Economical laminate pricing due to volume manufacturing process
This 2-layer rigid PCB features a 0.254 mm (10 mil) Rogers RO3006 substrate with 35 μm copper layers. The board dimensions are 63.44 mm x 48.5 mm, with a finished thickness of 0.3 mm. The PCB has a minimum trace/space of 4/4 mils, a minimum hole size of 0.3 mm, and an immersion gold surface finish.
It meets the IPC-Class-2 standards, the RO3006 PCB is well-suited for a variety of high-frequency applications, including automotive radar, global positioning satellite antennas, cellular telecommunications systems, patch antennas for wireless communications, direct broadcast satellites, datalink on cable systems, remote meter readers, and power backplanes.
| PCB Capability (RO3006) |
| PCB Material: | Ceramic-filled PTFE Composites |
| Designation: | RO3006 |
| Dielectric constant: | 6.15 |
| Dissipation Factor | 0.002 10GHz |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Laminate thickness: | 5mil(0.127mm), 10mil(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil (1.524mm ) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
Unlocking the Potential of RO3006 – A Versatile PCB Material for High-Frequency Applications
As a senior sales manager, I'm thrilled to introduce you to RO3006, a revolutionary printed circuit board (PCB) material that is poised to transform the landscape of high-frequency electronics. With its exceptional performance characteristics and unparalleled versatility, RO3006 is the go-to solution for engineers and manufacturers seeking to push the boundaries of what's possible in the realm of cutting-edge technology.
Unparalleled Dielectric Properties of RO3006
At the heart of RO3006's exceptional performance lies its exceptional dielectric properties. This material boasts a dielectric constant (Dk) of 6.15 ± 0.05 at 10 GHz, ensuring consistent and reliable signal transmission across a wide range of frequencies, from 8 GHz to 40 GHz. This level of precision and consistency is crucial in high-frequency applications, where even the slightest variation can have a significant impact on circuit performance.
Minimizing Signal Loss with RO3006's Low Dissipation Factor
Complementing its impressive dielectric characteristics, RO3006 also shines with its low dissipation factor (Df) of just 0.002 at 10 GHz. This remarkable property minimizes signal loss, enabling efficient power transfer and improved signal integrity for high-speed digital and RF applications. Whether you're designing antennas, radar systems, or high-speed data links, RO3006 ensures that your circuits operate with
unparalleled efficiency and reliability.
Ensuring Thermal Stability for Reliable Performance
In the world of high-frequency electronics, thermal stability is paramount. RO3006 excels in this regard, with a low thermal coefficient of dielectric constant (-262 ppm/°C) that ensures consistent performance across a wide temperature range, from -50°C to 150°C. This thermal stability makes RO3006 an ideal choice for demanding environments, where temperature fluctuations can wreak havoc on sensitive electronics.
Dimensional Stability: Maintaining Precision in High-Frequency Designs
Precision is the name of the game in high-frequency PCB design, and RO3006 delivers on this front as well. This material exhibits excellent dimensional stability, with X and Y-axis dimensional changes of just 0.27 mm/m and 0.15 mm/m, respectively, under conditioning A, as per IPC-TM-650 2.2.4 standards. This level of dimensional precision ensures that your high-frequency circuits maintain their intended performance characteristics, even in the face of challenging manufacturing and environmental conditions.
Lead-free Compatibility: Seamless Integration into Modern Manufacturing
In today's eco-conscious world, lead-free manufacturing processes have become the industry standard. RO3006 is fully compatible with these modern production lines, ensuring seamless integration and eliminating the need for costly workarounds or custom solutions.
Versatile Applications: Empowering High-Frequency Electronics
RO3006's exceptional performance characteristics make it a versatile material that finds its way into a wide range of high-frequency applications. From antennas and RF circuits for wireless communication systems to high-speed digital circuits for data centers and telecommunications infrastructure, RO3006 is the trusted partner for engineers and manufacturers seeking to push the boundaries of what's possible in the realm of cutting-edge technology.
As a senior sales manager, I'm excited to work with our customers to unlock the full potential of RO3006 and help them achieve their design goals with unparalleled success. If you're ready to take your high-frequency electronics to new heights, RO3006 is the solution you've been waiting for.
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RO3006 PCB 10mil For High-frequency Applications Images
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