Introduction
In today’s advanced RF and high-frequency electronics, signal integrity, thermal stability, and reliability are non-negotiable. Our 18-layer rigid PCB, constructed with Rogers RO4350B laminates and RO4450F bondply, is designed to meet the most demanding requirements in telecommunications, automotive radar, and aerospace applications. With ultra-low loss, tight dielectric constant (Dk) control, and superior thermal performance, this PCB ensures optimal functionality even in extreme conditions.
Precision Construction & Key Specifications
Every detail of this PCB is engineered for high-frequency stability and durability:
Base Material: High-performance RO4350B (core) + RO4450F (bondply) for superior RF characteristics.
Layer Count: 18 layers with 4/4 mil trace/space and 0.4mm minimum hole size.
Blind Vias: Mechanically drilled (L11-L18) for high-density interconnects.
Surface Finish: Immersion Gold + Selective Hard Gold (50 μin) for excellent solderability and corrosion resistance.
Via-in-Pad & Press-Fit Holes: Supported for enhanced mechanical and electrical performance.
Resin-Filled & Capped Vias: Improve reliability and prevent solder wicking.
100% Electrical Tested: Guaranteed functionality before shipment.
Optimized Stackup for Maximum Performance
The 18-layer stackup is meticulously designed to minimize signal loss and ensure thermal stability:
Alternating RO4350B cores (4mil) and RO4450F bondply (4mil) for consistent impedance control.
35μm copper layers (1oz) on all inner and outer layers for optimal current handling.
Low Z-axis CTE (32 ppm/°C) prevents via cracking under thermal stress.
High Tg (>280°C) ensures stability in high-temperature environments.
Why Rogers RO4350B & RO4450F?
RO4350B Laminates – The Gold Standard for RF PCBs
Dielectric Constant (Dk): 3.48 ±0.05 @ 10GHz – Ensures consistent signal propagation.
Ultra-Low Loss: Dissipation Factor (Df) of 0.0037 minimizes signal degradation.
Thermal Conductivity: 0.69 W/m/°K for efficient heat dissipation.
CTE Matched to Copper: Reduces warping and ensures dimensional stability.
RO4450F Bondply – Superior Multi-Layer Performance
Compatible with Sequential Lamination: Ideal for complex, high-layer-count designs.
Enhanced Lateral Flow: Ensures reliable filling of tight spaces.
High Thermal Resilience: Withstands multiple lamination cycles.
Ideal Applications
This PCB is perfect for industries requiring high-frequency precision and reliability, including:
5G & Cellular Base Stations (Antennas, Power Amplifiers)
Automotive Radar & ADAS Sensors
Satellite & Aerospace Communication Systems
RFID & IoT Devices
Quality Assurance & Global Availability
We adhere to IPC-Class-2 standards, ensuring high reliability for commercial and industrial applications. Our manufacturing process supports Gerber RS-274-X files, and we offer worldwide shipping to meet your production timelines.
Upgrade your high-frequency designs with a PCB that delivers performance, durability, and precision. Contact us now for competitive pricing, fast lead times, and Professional customer service.
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18 Layer RO4350B PCB 3.2mm High Performance ENIG + Selective Hard Gold Images
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